Min Kyu Hwang

Title: Min Kyu Hwang: Innovator in Semiconductor Adhesives

Introduction

Min Kyu Hwang is a notable inventor based in Uiwang-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the development of advanced adhesive materials. With a total of 2 patents to his name, Hwang's work is recognized for its innovation and practical applications in the industry.

Latest Patents

Hwang's latest patents include an "Optically Clear Adhesive for Dicing Die Bonding Film" and a "Dicing Die Bonding Film, Semiconductor Wafer, and Semiconductor Device." The optically clear adhesive patent describes a formulation that includes a curing agent and an acrylic copolymer, which features an alkyl group, a hydroxyl group, and at least one of a phosphate group and a silane group. The second patent focuses on a dicing die bonding film that comprises a bonding layer and a pressure-sensitive adhesive layer. This adhesive layer is designed to have a storage modulus of about 400 to about 600 kPa at 25°C and a peel strength of about 200 to about 350 mN/25 mm, measured according to the KS-A-01107 standard.

Career Highlights

Min Kyu Hwang is currently employed at Cheil Industries Inc., where he continues to push the boundaries of adhesive technology in the semiconductor sector. His work has been instrumental in enhancing the performance and reliability of semiconductor devices.

Collaborations

Hwang collaborates with talented colleagues, including Ji Ho Kim and Kyoung Jin Ha, who contribute to the innovative environment at Cheil Industries Inc. Their teamwork fosters a culture of creativity and excellence in research and development.

Conclusion

Min Kyu Hwang's contributions to the field of semiconductor adhesives exemplify the impact of innovation in technology. His patents reflect a commitment to advancing materials that enhance device performance. Hwang's work continues to influence the semiconductor industry positively.