Company Filing History:
Years Active: 2004
Title: Michael Zhong Xuan Wong - Innovator in High-Speed Package Design
Introduction
Michael Zhong Xuan Wong is an accomplished inventor based in Milpitas, California. With a keen focus on advancing technology in the field of high-speed packaging, Wong has developed innovative solutions that enhance performance and reliability in electronic systems.
Latest Patents
Wong holds a patent for a "High-speed package design with suspended substrates and PCB." This integrated high-speed package features a housing design that includes a housing lip and connector with a center pin that maintains alignment with the substrate's signal lead. The design cleverly incorporates a "floated" registration approach that ensures the top surface of the first substrate is perfectly aligned with the signal lead, thus allowing optimal signal transmission. Moreover, the housing base is ingeniously crafted with varying heights to accommodate substrates of different thicknesses, facilitating coplanar alignment and enhancing signal registration between multiple substrates.
Career Highlights
Wong is currently associated with Big Bear Networks, Inc., where he applies his extensive knowledge in electronics and engineering to develop cutting-edge packaging solutions. His work is pivotal in the company’s mission to innovate and excel in high-performance technology sectors.
Collaborations
Throughout his career, Wong has collaborated with notable peers such as Yu Ju Chen and Thomas J Sleboda. Together, their combined expertise fosters a culture of innovation at Big Bear Networks, driving the development of advanced technologies that meet the evolving needs of the electronics industry's demands.
Conclusion
Michael Zhong Xuan Wong's contributions to high-speed package design exemplify the essence of innovation in technology. His patent and collaborative efforts at Big Bear Networks, Inc. signify a commitment to enhancing electronic performance, ensuring reliability, and pushing the boundaries of what is possible in the realm of packaging technology.