Michael T Boldman

Title: Innovations by Michael T. Boldman

Introduction

Michael T. Boldman is an accomplished inventor based in Murphy, Texas, known for his significant contributions to the field of soldering technology. With a total of three patents to his name, Boldman has developed innovative methods that enhance the efficiency and effectiveness of soldering processes.

Latest Patents

One of his latest patents is titled "Direct solder bumping of hard to solder substrate." This invention presents a method for direct solder 'bumping' of wafers, chips, and interconnection pads on hard-to-solder surfaces such as aluminum and indium tin oxide. Boldman discovered that conventional solders, modified by the addition of a light reactive metal, can be jetted in microdroplets onto these challenging substrates. This groundbreaking technique allows for the creation of solder bumps on bare, uncoated hard-to-solder substrates without the need for a different surface that conventional solder would typically require.

Another notable patent is the "Printhead for liquid metals and method of use." This invention features a compact printhead assembly designed for soldering operations without the need for fluxes or confined chambers. The self-contained printhead includes an internal reservoir and heating elements that raise the temperature above the melting point of solder or other liquids. The jetting device, equipped with an electro-mechanical transducer, produces droplets at an exit orifice, while preheated inert gas establishes an oxygen-free atmosphere, allowing for the formation and deposition of microdrops without harmful oxidation.

Career Highlights

Boldman is currently associated with Microfab Technologies Inc., where he continues to innovate and develop advanced soldering technologies. His work has significantly impacted the industry, providing solutions that improve the reliability and performance of electronic components.

Collaborations

Throughout his career, Boldman has collaborated with notable colleagues, including Donald J. Hayes and David B. Wallace. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Michael T. Boldman's contributions to soldering technology exemplify the spirit of innovation and problem-solving in the field of engineering. His patents not only address existing challenges but also pave the way for future advancements in the industry.