Augsburg, Germany

Michael Reiprich


 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2010

Loading Chart...
Loading Chart...
1 patent (USPTO):Explore Patents

Title: Michael Reiprich: Innovator in Flap Support Structures

Introduction

Michael Reiprich is a notable inventor based in Augsburg, Germany. He has made significant contributions to the field of engineering, particularly in the design of support structures for retractable and extendable flaps. His innovative approach has led to the development of a unique patent that addresses the challenges associated with fluid dynamics.

Latest Patents

Reiprich holds a patent for a "Support structure for a retractable and extendable flap, and use of said structure." This invention relates to a support structure that is associated with an object surrounded by a flowing fluid. The design features a shell profile that has a fluid/aerodynamic low-drag form on the outer side, while the inner side forms a chamber for at least partially receiving a device for retracting and extending the flap. This patent showcases his ability to merge functionality with aerodynamic efficiency.

Career Highlights

Michael Reiprich is currently employed at Mt Aerospace AG, where he continues to innovate and develop new technologies. His work at the company has allowed him to apply his expertise in aerospace engineering, contributing to advancements in the industry.

Collaborations

Throughout his career, Reiprich has collaborated with talented individuals such as Aicke Patzelt and Gunther Stegmaier. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Michael Reiprich is a distinguished inventor whose work in support structures for flaps has made a significant impact in the field of aerospace engineering. His innovative patent and collaborations with other professionals highlight his commitment to advancing technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…