Location History:
- Westminster, MD (US) (2017 - 2021)
- Sparks, MD (US) (2021)
Company Filing History:
Years Active: 2017-2021
Title: Michael Reick: Innovator in Encapsulation Technology
Introduction
Michael Reick is a notable inventor based in Westminster, MD (US). He has made significant contributions to the field of encapsulation technology, holding a total of 3 patents. His work focuses on developing innovative products that enhance the functionality and application of encapsulated materials.
Latest Patents
One of Michael's latest patents is titled "High Integrity Encapsulation Product with Insoluble Fibers." This invention describes a particulate extrusion encapsulation product in a glassy state, which includes an encapsulate surrounded by a glassy matrix. The matrix consists of at least one modified starch, one carbohydrate, and one insoluble fiber. The encapsulate load typically ranges from 0.01% to 20% by weight, based on the total weight of the encapsulation product. Another significant patent is for "Extrusion Encapsulation with Narrow Particle Size and Shape Distribution." This invention details a glassy, particulate, melt extrusion encapsulation composition that is highly soluble in aqueous systems. It features a low level of encapsulate on the surface of the particles and maintains a narrow particle size and shape distribution.
Career Highlights
Michael Reick is currently employed at McCormick & Company, Inc., where he continues to innovate in the field of food technology. His work has led to advancements that improve the quality and effectiveness of food products through enhanced encapsulation methods.
Collaborations
Michael has collaborated with talented coworkers such as Dmitriy Zasypkin and Shriram Paranjpe. Their combined expertise contributes to the innovative projects at McCormick & Company, Inc.
Conclusion
Michael Reick is a distinguished inventor whose work in encapsulation technology has led to multiple patents and significant advancements in food product development. His contributions continue to shape the industry and enhance the functionality of encapsulated materials.