Company Filing History:
Years Active: 2019
Title: Michael P. Wald: Innovator of Non-Slip Coarse Sandpaper
Introduction
Michael P. Wald is an accomplished inventor based in Ankeny, Iowa. He has made notable contributions to the field of materials engineering, particularly with his innovative patent related to sandpaper technology. His invention focuses on enhancing the performance and safety of coarse sandpaper through a unique non-slip coating.
Latest Patents
Wald holds one patent for his invention of coarse sandpaper with a non-slip coating layer. The patent describes a sheet of coarse sandpaper that features a backing layer with two major surfaces. This design includes an adhesive make coat on the second major surface and coarse abrasive particles embedded within the make coat, creating a rough abrasive surface. Notably, an exposed non-slip coating layer on the first major surface enhances grip and usability. The patent also outlines methods for making and using this innovative sandpaper.
Career Highlights
Michael P. Wald is associated with 3M Innovative Properties Company, a leader in innovation across various industries. His work is characterized by a commitment to developing practical solutions that improve product functionality and user safety. The invention of non-slip coarse sandpaper is a testament to his innovative mindset and dedication to engineering excellence.
Collaborations
Throughout his career, Wald has collaborated with talented colleagues, including Thomas E. Pahl and John G. Petersen. These partnerships have contributed to the successful development and implementation of several innovative projects within the company.
Conclusion
Michael P. Wald exemplifies the spirit of innovation in materials engineering. His groundbreaking patent for non-slip coarse sandpaper enhances safety and effectiveness in various applications, reflecting his commitment to improving product performance. As a member of 3M Innovative Properties Company, Wald continues to influence the industry through his valuable contributions.