Company Filing History:
3 out of 382 
1 out of 781 
1 out of 386 
Years Active: 1979-1987
Title: Michael K Avedissian: Innovator in Ultrasonic Bonding Technology
Introduction
Michael K Avedissian is a notable inventor based in Mohnton, PA (US). He holds a total of 4 patents that showcase his contributions to the field of ultrasonic bonding technology. His innovative designs have significantly impacted the efficiency and precision of bonding processes in various applications.
Latest Patents
Avedissian's latest patents include a device for registering articles to sites with a recessed ultrasonic bonding tool head. This invention features a head that precisely registers an article, such as an electronic chip, to a site for operations like bonding. The design includes a body with an upper portion for support and a lower portion that terminates in a working face, which has a cavity for engaging the chip. This innovative approach allows for better visibility and handling of the chip during the bonding process.
Another significant patent involves engaging second articles to first articles using a head that engages a chip and then bonds it to a substrate. This design incorporates a vacuum bore for holding the chip and pockets that create air streams to capture and hold the workpiece against the chip. This simultaneous registration of both components enhances the bonding process, ensuring uniform application and reaction to contact surfaces.
Career Highlights
Throughout his career, Avedissian has worked with prominent companies such as AT&T Technologies, Inc. and Western Electric Company, Inc. His experience in these organizations has contributed to his expertise in developing innovative bonding technologies.
Collaborations
Avedissian has collaborated with notable coworkers, including Donald M Large and Anthony J Schorr. Their combined efforts have further advanced the field of ultrasonic bonding technology.
Conclusion
Michael K Avedissian's contributions to ultrasonic bonding technology through his patents and career experiences highlight his role as an influential inventor. His innovative designs continue to shape the industry and improve bonding processes across various applications.