Company Filing History:
Years Active: 2005
Title: Michael J Varnau: Innovator in Wafer-Applied Underfill Process
Introduction
Michael J Varnau is a notable inventor based in Russiaville, Indiana. He has made significant contributions to the field of semiconductor packaging through his innovative patent. His work focuses on enhancing the reliability and efficiency of electronic components.
Latest Patents
Varnau holds a patent for a "Wafer-applied underfill process." This process involves underfilling a bumped die surface using a lamination step and compound film. The solder bumps on the die are exposed during lamination, allowing for effective filling of spaces between the bumps without covering them. The compound film consists of a first layer containing an underfill material and a second layer that differs in polymer composition. This innovative approach ensures that the underfill material is effectively forced between the solder bumps while maintaining their exposure.
Career Highlights
Michael J Varnau is associated with Delphi Technologies, Inc., where he applies his expertise in semiconductor technology. His work has contributed to advancements in the manufacturing processes of electronic devices. With a focus on improving product reliability, Varnau's innovations have had a lasting impact on the industry.
Collaborations
Varnau has collaborated with notable colleagues, including Frank Stepniak and Matthew R Walsh. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Michael J Varnau's contributions to the field of semiconductor packaging through his patented wafer-applied underfill process exemplify his commitment to innovation. His work continues to influence the industry and improve the reliability of electronic components.