Campbell, CA, United States of America

Michael J Anderson


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Campbell, CA (US) (2019)
  • Peabody, MA (US) (2023)

Company Filing History:


Years Active: 2019-2023

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2 patents (USPTO):Explore Patents

Title: Michael J Anderson: Innovator in Stacked Circuit Package Technology

Introduction

Michael J Anderson is a notable inventor based in Campbell, CA (US). He has made significant contributions to the field of electronics, particularly in the development of stacked circuit packages. With a total of 2 patents, Anderson's work has advanced the technology used in electronic components.

Latest Patents

One of Anderson's latest patents is for a stacked circuit package with a molded base having laser-drilled openings for the upper package. This innovative design includes a bottom package with a substrate that features first circuitry and metal first pads. A molded layer is formed over the substrate, and holes are laser drilled through this layer to expose the first pads. These holes align with leads of an upper package that contains additional circuit components. The process involves partially filling the holes with solder paste and applying thermal epoxy between the molded layer and the upper package. The leads of the upper package are then inserted into the holes, and the solder paste is reflowed to create electrical, thermal, and mechanical connections. The reflow heat also cures the epoxy, and a ball grid array is formed on the bottom of the substrate.

Career Highlights

Throughout his career, Michael J Anderson has worked with prominent companies in the electronics industry, including Linear Technology and Analog Devices. His experience in these organizations has contributed to his expertise in circuit design and packaging technology.

Collaborations

Anderson has collaborated with notable professionals in his field, including John David Brazzle and Frederick E Beville. These collaborations have likely enriched his work and led to further innovations in circuit packaging.

Conclusion

Michael J Anderson's contributions to the field of electronics, particularly through his patents on stacked circuit packages, demonstrate his innovative spirit and technical expertise. His work continues to influence the design and functionality of electronic components today.

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