Michael I Grove

Title: Michael I Grove - Innovator in Integrated Circuit Packaging

Introduction

Michael I Grove is a notable inventor based in Redwood City, CA. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of advanced technologies that enhance the performance and efficiency of electronic devices.

Latest Patents

Michael I Grove holds a patent for a "Packaging and interconnect system for integrated circuits." This invention features a thin MCM packaging structure that utilizes a thin film decal interconnect circuit fabricated on a thin aluminum wafer. The design employs Au metallurgy for bonding and includes a bond pad/ground plane layer, topside pads, and multiple routing layers. The unique structure allows for effective bonding and encapsulation of integrated circuit dies, improving the overall functionality of electronic systems.

Career Highlights

Michael I Grove is associated with Micromodule Systems, Inc., where he has played a crucial role in advancing packaging technologies. His work has been instrumental in developing solutions that meet the growing demands of the electronics industry. With a focus on innovation, he continues to push the boundaries of what is possible in integrated circuit design.

Collaborations

Throughout his career, Michael has collaborated with talented individuals such as Mark T McGraw and Bradley L Griswold. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Michael I Grove's contributions to integrated circuit packaging exemplify the spirit of innovation. His patent and work at Micromodule Systems, Inc. highlight his commitment to advancing technology in the electronics field. His achievements serve as an inspiration for future inventors and innovators.