Company Filing History:
Years Active: 1978-1982
Title: Innovations by Michael H Scott
Introduction
Michael H Scott is a notable inventor based in Cambridge, GB. He has made significant contributions to the field of electrical interconnection methods, particularly focusing on the bonding of aluminum wires to small electrical circuits. With a total of 2 patents, his work has advanced the technology used in electrical bonding processes.
Latest Patents
One of his latest patents is an "Electrical inter-connection method." This innovation allows for the ball-bonding of aluminum or aluminum alloy wires to small electrical circuits or components. By creating a spark discharge between the end of the wire and an electrode in a shielding atmosphere, he achieves a peak current density in the wire section that is from 40 to 450 times that used for ball-bonding gold wire. This method effectively prevents oxidation of the ball. Another significant patent is the "Bonding method and apparatus." This invention addresses the difficulties in forming a ball on the end of an aluminum wire for ball bonding. By applying a low voltage, typically 30 volts, between the wire and an electrode, and bringing them into temporary contact, a spark discharge is initiated. This process occurs in a shielding gas to avoid oxidation of the ball.
Career Highlights
Michael H Scott is associated with The Welding Institute, where he continues to innovate and contribute to advancements in welding and bonding technologies. His expertise in electrical interconnections has positioned him as a key figure in his field.
Collaborations
Throughout his career, Michael has collaborated with notable coworkers such as Donald A Edson and Keith I Johnson. These partnerships have further enriched his work and contributed to the development of new technologies.
Conclusion
Michael H Scott's contributions to the field of electrical interconnection methods demonstrate his innovative spirit and commitment to advancing technology. His patents reflect a deep understanding of the challenges in bonding processes and offer solutions that enhance the reliability of electrical connections.