Clemmons, NC, United States of America

Michael G Pacyga


Average Co-Inventor Count = 6.5

ph-index = 2

Forward Citations = 37(Granted Patents)


Company Filing History:


Years Active: 2003-2005

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2 patents (USPTO):Explore Patents

Title: Michael G Pacyga: Innovator in Modular Jack Assembly Technology

Introduction

Michael G Pacyga is a notable inventor based in Clemmons, NC (US). He has made significant contributions to the field of electronics, particularly in the development of modular jack assemblies. With a total of 2 patents, Pacyga's work showcases his innovative approach to signal conditioning technology.

Latest Patents

One of Pacyga's latest patents is a modular jack assembly with signal conditioning. This invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies consist of an elongate beam support featuring a plurality of modular jack contacts on both sides. These contacts extend into printed circuit board contacts and reach beyond the side edges of the elongate beam platform. This design leaves space above and below the printed circuit board contacts and the beam support free, allowing for the accommodation of signal conditioning componentry. Additionally, two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are designed to be insertable into the housing, defining modular jacks in the outer housing.

Career Highlights

Michael G Pacyga has been associated with Tyco Electronics Corporation, where he has applied his expertise in electronics and innovation. His work has contributed to advancements in modular jack technology, enhancing the performance and functionality of electronic devices.

Collaborations

Throughout his career, Pacyga has collaborated with notable colleagues, including Thomas Wojtacki and Kevin John Peterson. These collaborations have fostered a creative environment that has led to the development of innovative solutions in the field of electronics.

Conclusion

Michael G Pacyga's contributions to modular jack assembly technology reflect his dedication to innovation in electronics. His patents and collaborations highlight his role as a significant inventor in this field.

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