Michael DiPietro

Title: Michael DiPietro: Innovator in Integrated Circuit Testing

Introduction

Michael DiPietro is a notable inventor based in Vestal, NY (US). He has made significant contributions to the field of integrated circuit testing, holding a total of 5 patents. His innovative designs have advanced the technology used in electronic packaging and testing.

Latest Patents

One of DiPietro's latest patents is a test socket for testing integrated circuit packages. This socket is designed for testing an integrated circuit ball grid array package, featuring a flexible bladder that conforms to the package's non-planar configuration. The bladder's upper side has a test contact pattern that matches the solder balls on the package, ensuring effective testing. Another significant patent involves an electronic package with a thermally conductive support member. This package includes a rigid support member, such as a copper sheet, which bonds both the semiconductor chip and circuitized substrate members. The innovative use of thermally conductive adhesive for the chip and electrically insulative adhesive for the substrate enhances the performance and reliability of the electronic package.

Career Highlights

Throughout his career, Michael DiPietro has worked with prominent companies in the technology sector. He has been associated with IBM and LSI Logic Corporation, where he contributed to various projects that pushed the boundaries of electronic design and testing.

Collaborations

DiPietro has collaborated with notable professionals in his field, including Frank E. Andros and James Russell Bupp. These collaborations have fostered innovation and development in integrated circuit technology.

Conclusion

Michael DiPietro's contributions to the field of integrated circuit testing and electronic packaging are noteworthy. His patents reflect a commitment to advancing technology and improving testing methodologies. His work continues to influence the industry and inspire future innovations.