Pittsburgh, PA, United States of America

Metin Setti


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Metin Setti

Metin Setti is an inventor based in Pittsburgh, PA, renowned for his contribution to the field of adhesive technologies. With a singular patent to his name, Setti represents the spirit of innovation that drives the advancement of materials science.

Latest Patents

Metin Setti holds a patent for an "Adhesive Microstructure and Method of Forming Same." This invention describes a fabricated microstructure featuring at least one protrusion that provides an adhesive force ranging from approximately 60 to 2,000 nano-Newtons. The structural design is characterized by a stalk that supports the protrusion at an oblique angle relative to a supporting surface, allowing the microstructure to adhere effectively to various surfaces.

Career Highlights

Currently, Metin Setti is associated with the University of California, where he contributes his expertise to research and development in the field of engineering and material sciences. His work emphasizes the importance of innovative solutions in adhesive technologies, making significant strides in practical applications.

Collaborations

In his professional journey, Metin Setti has collaborated with notable peers, including Ronald S. Fearing. Together, they explore advancements in engineering that push the boundaries of material capabilities. Their combined efforts showcase the collaborative nature of research and innovation, bridging ideas from different minds to create impactful technology.

Conclusion

Metin Setti’s contributions to adhesive microstructures embody the essence of modern innovation. Through his patent and collaborative work, he continues to pave the way for new advancements in the field, impacting both academia and industry. His journey inspires future inventors to explore the limitless possibilities within the realm of technological development.

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