Shanghai, China

Mengmeng Wang

USPTO Granted Patents = 1 

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations of Mengmeng Wang in Aluminum Alloy Materials

Introduction

Mengmeng Wang is a prominent inventor based in Shanghai, China. She has made significant contributions to the field of materials science, particularly in the development of high-toughness heat-resistant aluminum alloys. Her innovative work has the potential to enhance various applications in engineering and technology.

Latest Patents

Mengmeng Wang holds a patent for a "High-toughness heat-resistant aluminum alloy armature material and preparation method thereof." This patent describes a method for preparing a high-toughness heat-resistant aluminum alloy armature material. The process involves heating and melting an aluminum ingot into a liquid state and adding specific elements in mass percent, including Ce, Y, Zr, Mg, X, Fe, Mn, and Si. The resulting alloy solution is cast into an ingot, processed into spherical alloy powder, and subjected to selective laser melting and solidification. This innovative material boasts low density, high-temperature resistance, high energy absorption rate, excellent electrical conductivity, and outstanding mechanical properties at both room and high temperatures.

Career Highlights

Mengmeng Wang is affiliated with Shanghai Jiaotong University, where she continues her research and development in advanced materials. Her work has garnered attention for its practical applications and contributions to the field of materials engineering.

Collaborations

Mengmeng Wang collaborates with esteemed colleagues, including Haiyan Gao and Haiyang Lv, who contribute to her research endeavors and enhance the impact of her innovations.

Conclusion

Mengmeng Wang's contributions to the development of high-toughness heat-resistant aluminum alloys represent a significant advancement in materials science. Her innovative methods and collaborative efforts continue to push the boundaries of technology and engineering.

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