Matthew R Lueck

Title: Innovations by Matthew R. Lueck

Introduction

Matthew R. Lueck is an accomplished inventor based in Raleigh, NC (US). He has made significant contributions to the field of electronic packaging through his innovative patent. His work focuses on enhancing the efficiency and reliability of electronic devices.

Latest Patents

Matthew R. Lueck holds a patent titled "Die bonding utilizing a patterned adhesion layer." This invention describes an electronic package and a method for forming the electronic package. The electronic package consists of a first substrate that includes a first electronic device and features through-holes extending through its entire thickness. A second substrate is bonded to the first substrate, with metallizations formed in the through-holes to connect to components of the first electronic device. A patternable substance is disposed between the two substrates, adhering them together in regions apart from the metallizations. The method involves forming through-holes, depositing and patterning an adherable substance, aligning and attaching the substrates, and forming metallizations to connect to a second electronic device.

Career Highlights

Matthew R. Lueck is associated with the Research Triangle Institute, where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing technologies that improve the performance of electronic devices.

Collaborations

Matthew has collaborated with notable colleagues, including Erik Paul Vick and Dean Michael Malta, who have contributed to his research and development efforts.

Conclusion

Matthew R. Lueck's contributions to electronic packaging through his innovative patent demonstrate his expertise and commitment to advancing technology. His work continues to influence the field and pave the way for future innovations.