Location History:
- Kyoto, JP (1986 - 1991)
- Uji, JP (1993 - 2006)
Company Filing History:
8 out of 50 
1 out of 1 Years Active: 1986-2006
Title: The Innovations of Masato Takami
Introduction
Masato Takami is a prominent inventor based in Uji, Japan, known for his significant contributions to the field of copper foil technology. With a total of nine patents to his name, Takami has made remarkable advancements that enhance the performance and usability of printed circuit boards.
Latest Patents
One of his latest patents is for a surface-treated copper foil designed for printed-wiring boards. This invention aims to provide a copper foil that allows for a direct drilling process using carbon dioxide laser, featuring a surface layer that is prepared with a minimal amount of covering material. The covering layer consists of iron and tin, or an alloy of iron, tin, and other selected metals, ensuring efficient drilling capabilities. Another notable patent involves a method of treating copper foil for printed circuits, which enhances resin dust resistance, heat discoloration resistance, and rust preventiveness. This method includes a first layer of zinc alloy and a second layer formed from a mixture of benzotriazole derivative and phosphorus compound, ensuring optimal performance in electronic applications.
Career Highlights
Throughout his career, Masato Takami has worked with notable companies such as Fukuda Metal Foil & Powder Co., Ltd. and Fukuda Metal Foil & Powder Industrial Co., Ltd. His work in these organizations has allowed him to develop innovative solutions that address the challenges faced in the manufacturing of printed circuit boards.
Collaborations
Takami has collaborated with esteemed colleagues, including Katsuhito Fukuda and Masami Yano, contributing to the advancement of technology in the field of copper foil production.
Conclusion
Masato Takami's contributions to the field of copper foil technology have significantly impacted the industry, showcasing his innovative spirit and dedication to improving electronic manufacturing processes. His patents reflect a commitment to excellence and a forward-thinking approach to technology.