Masaru Maeda

Title: Masaru Maeda: Innovator in Semiconductor Technology

Introduction

Masaru Maeda is a prominent inventor based in Ota, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to multi wire bonding.

Latest Patents

One of Masaru Maeda's notable patents is titled "Multi wire bonding with current sensing method." This invention involves implementations of a semiconductor package system that includes a first bond wire bonded to a portion of a leadframe and to a pad of a semiconductor die. The first bond wire is coupled to either a power source or a ground. Additionally, a second bond wire is bonded to the portion of the leadframe and to a control integrated circuit. The leadframe portion forms a current sense area, and the control integrated circuit is designed to utilize the second bond wire and the current sense area to measure the current flowing through the first bond wire during operation. This innovation enhances the efficiency and reliability of semiconductor devices.

Career Highlights

Masaru Maeda is currently employed at Semiconductor Components Industries, LLC, where he continues to develop cutting-edge technologies in the semiconductor sector. His work has been instrumental in advancing the capabilities of semiconductor packaging.

Collaborations

Throughout his career, Masaru has collaborated with notable colleagues, including Hiroshi Inoguchi and Takashi Nagashima. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Masaru Maeda's contributions to semiconductor technology, particularly through his patent on multi wire bonding, highlight his role as a key innovator in the field. His work continues to influence the industry and pave the way for future advancements.