Ichihara, Japan

Masao Miyama


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 53(Granted Patents)


Location History:

  • Sodegaura, JP (1989)
  • Ichihara, JP (1990)

Company Filing History:


Years Active: 1989-1990

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2 patents (USPTO):Explore Patents

Title: Masao Miyama: Innovator in Resin Technology

Introduction

Masao Miyama is a notable inventor based in Ichihara, Japan. He has made significant contributions to the field of resin technology, holding 2 patents that showcase his innovative approaches to manufacturing multi-layer resin materials.

Latest Patents

Miyama's latest patents include a "Method of manufacturing multi-layer resin material" and a "Thermoforming resin laminate sheet." The first patent describes a method that employs various thermoplastic resins to create a multi-layer resin material. In this process, resins for the inner and outer layers are supplied into a feed block of a T-die coextrusion apparatus, ensuring that the extruded sheet has lateral edges made of a single resin. The second patent focuses on a resin laminate that features a gas permeation-resistant resin layer, laminated with polyolefin-based resin layers containing inorganic fillers. This innovative laminate minimizes oxygen gas permeability and is particularly useful as a packaging material.

Career Highlights

Miyama is currently associated with Idemitsu Petrochemical Co., Ltd., where he continues to develop advanced resin technologies. His work has significantly impacted the industry, particularly in enhancing the performance and functionality of resin materials.

Collaborations

Miyama has collaborated with notable coworkers such as Toyokazu Yamada and Hideo Sugimura, contributing to the advancement of resin technology through teamwork and shared expertise.

Conclusion

Masao Miyama's contributions to resin technology through his patents and career at Idemitsu Petrochemical Co., Ltd. highlight his role as an influential inventor in the field. His innovative methods and materials continue to shape the industry and improve packaging solutions.

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