Otsu, Japan

Masao Kaji


Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 26(Granted Patents)


Location History:

  • Otsu, JA (1977)
  • Otsu, JP (1978)

Company Filing History:


Years Active: 1977-1978

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2 patents (USPTO):Explore Patents

Title: The Innovations of Masao Kaji

Introduction

Masao Kaji is a notable inventor based in Otsu, Japan. He has made significant contributions to the field of plating technology, holding two patents that showcase his innovative approach to achieving constant current density in plating processes.

Latest Patents

Kaji's latest patents include a "Constant Current Density Plating Method" and a "Method and Apparatus for Plating Under Constant Current Density." Both patents describe a plating method that utilizes a bath containing an electrolyte solution with a uniform ion concentration. In these methods, a common electrode, a plating electrode, and a standard electrode are arranged in the bath. A direct current source is connected between the common electrode and the plating electrode, while a constant direct current source is connected between the common electrode and the standard electrode. A potentiometer device detects resistance changes between the electrodes due to variations in ion concentration and electrolyte mobility. This information is used to regulate the plating current, ensuring a constant plating current density is achieved.

Career Highlights

Masao Kaji is associated with New Nippon Electric Co., Ltd., where he has been instrumental in advancing plating technologies. His work has contributed to the efficiency and effectiveness of plating processes in various applications.

Collaborations

Kaji collaborates with Hiroshi Asami, a coworker who shares his commitment to innovation in the field of plating technology.

Conclusion

Masao Kaji's contributions to plating technology through his patents reflect his dedication to innovation and improvement in industrial processes. His work continues to influence the field and showcases the importance of constant current density in plating applications.

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