Company Filing History:
Years Active: 2023
Title: Masanori Aramata: Innovator in Substrate Bonding Technology
Introduction
Masanori Aramata is a prominent inventor based in Tokyo, Japan, renowned for his contributions to the field of substrate bonding technology. With a focus on enhancing manufacturing processes, he has developed innovative solutions that improve the throughput of substrate bonding.
Latest Patents
Masanori Aramata holds a singular patent titled "Substrate bonding apparatus and substrate bonding method." This patented technology is designed to bond first and second substrates effectively. The invention ensures that contact regions—where the substrates meet—are formed optimally, allowing for enlargement from specific contact points. A key feature of the apparatus includes a detecting unit that monitors information concerning these contact regions. Furthermore, a determining unit assesses whether the bonding process is feasible based on the detected information. This patent marks a significant advancement in the substrate bonding field, introducing a system that ensures efficiency in production.
Career Highlights
Aramata's career is closely linked with Nikon Corporation, a company known for its technological expertise and innovation in imaging and optical products. His work there as an inventor has showcased a commitment to improving industrial processes through innovative technologies.
Collaborations
Throughout his career, Masanori Aramata has collaborated with notable coworkers including Isao Sugaya and Eiji Ariizumi. These partnerships highlight the collaborative spirit prevalent in the industry, contributing to the successful development and refinement of groundbreaking technologies in substrate bonding.
Conclusion
Masanori Aramata's innovative patent in substrate bonding illustrates his dedication to advancing manufacturing technology. His work not only reflects individual creativity but also showcases the importance of collaboration and knowledge-sharing within the field. As he continues to contribute to Nikon Corporation, his inventions will undoubtedly play a vital role in shaping the future of substrate bonding technologies.