Location History:
- Takasago, JP (2009 - 2012)
- Hyogo, JP (2014)
Company Filing History:
Years Active: 2009-2014
Title: Masakuni Ueno: Innovator in Epoxy Resin Technology
Introduction
Masakuni Ueno is a prominent inventor based in Takasago, Japan. He has made significant contributions to the field of epoxy resin technology, holding a total of 5 patents. His work focuses on improving the properties and production processes of epoxy resin compositions.
Latest Patents
Ueno's latest patents include a process for producing modified epoxy resin. This innovative epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles maintain a finely dispersed state of primary particles. The content of these particles ranges from 0.5 to 80% by weight when the total amount of the epoxy resin and rubber-like polymer particles is 100% by weight. The rubber-like polymer particles are produced by graft-polymerizing a shell layer with a rubber particle core, resulting in an average particle diameter of 0.03 to 2 µm. This invention provides a method for producing an epoxy resin composition that has core/shell rubber particles dispersed in an epoxy resin, ensuring excellent dispersion with reduced contaminants.
Career Highlights
Masakuni Ueno is associated with Kaneka Corporation, where he has been instrumental in advancing epoxy resin technologies. His innovative approaches have led to the development of high-performance materials that are widely used in various applications.
Collaborations
Ueno has collaborated with notable colleagues, including Ryuji Furukawa and Katsumi Yamaguchi. Their combined expertise has contributed to the success of their projects and the advancement of epoxy resin technology.
Conclusion
Masakuni Ueno's contributions to the field of epoxy resin technology highlight his innovative spirit and dedication to improving material properties. His patents reflect a commitment to advancing the industry and providing solutions that enhance product performance.