Sagamihara, Japan

Masaaki Takeda

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.4

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2003-2025

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Masaaki Takeda

Introduction

Masaaki Takeda, an inventive mind based in Sagamihara, Japan, is known for his significant contributions to the field of adhesives. With a focus on developing advanced materials, Takeda has made strides in creating solutions tailored for modern technological needs.

Latest Patents

Takeda holds a patent for a novel thermosetting adhesive composition and adhered structure. This invention showcases adhesives that are particularly advantageous for bonding electronic parts. Notably, these adhesives can be cured using a low dose of radiation, such as electron beam, enhancing their efficiency and applicability in electronics manufacturing. The composition consists of (a) ethylene-glycidyl (meth)acrylate copolymer, (b) rosin with a carboxyl group, and (c) (meth)acrylate with a carboxyl group, making it a versatile solution for various applications.

Career Highlights

Currently, Masaaki Takeda is associated with 3M Innovative Properties Company, where he contributes his expertise in material science and adhesive technology. His work is vital to the development of innovative products utilized in various industries, particularly electronics.

Collaborations

In his professional journey, Takeda collaborates with esteemed colleagues such as Naoyuki Toriumi and Koichiro Kawate. Their collective efforts reflect a strong partnership in pushing the boundaries of adhesive technology, leading to impactful innovations that benefit numerous sectors.

Conclusion

Masaaki Takeda's dedication to innovation in adhesive solutions positions him as a noteworthy inventor in his field. Through his patent and collaborative efforts at 3M Innovative Properties Company, he continues to shape the future of bonding technologies, paving the way for advances in electronic component manufacturing.

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