Martin P Wai

Title: Martin P. Wai: Innovator in Fiber Tape Technology

Introduction

Martin P. Wai is a notable inventor based in Cheshire, CT (US). He has made significant contributions to the field of composite materials, particularly through his innovative patent related to unidirectional fiber tape. His work is essential for advancements in resin transfer molding processes.

Latest Patents

Martin P. Wai holds a patent for a low resin content unidirectional fiber tape. This invention is designed for incorporating unidirectional fibers in dry fiber preforms used in resin transfer molding. The tape features a plurality of unidirectional fibers sandwiched between two thin, flexible resin films. These films hold the fibers together without significant infiltration, allowing for easy handling and application. The total resin content of the films ranges from 1% to 20%, ideally between 3% and 15% by weight. This low resin content facilitates the later infiltration of injection resin, ensuring full integration of the fibers into the final product.

Career Highlights

Martin P. Wai is associated with Dow-United Technologies Composite Products, Inc. His role in the company has allowed him to focus on developing innovative solutions in composite materials. His expertise in fiber technology has positioned him as a key player in the industry.

Conclusion

Martin P. Wai's contributions to the field of composite materials through his patent for low resin content unidirectional fiber tape demonstrate his innovative spirit and commitment to advancing technology. His work continues to influence the resin transfer molding process and the broader field of materials science.