Company Filing History:
Years Active: 1996
Title: The Innovations of Marlita F. Macaraeg
Introduction
Marlita F. Macaraeg is a notable inventor based in Milpitas, California. She has made significant contributions to the field of semiconductor technology. Her work focuses on improving the structures used in semiconductor dies, which are crucial for modern electronic devices.
Latest Patents
Marlita holds a patent for her invention titled "Bump formation on yielded semiconductor dies." This innovative patent describes a ball bump structure that provides a hermetically sealed bond pad at the surface of a semiconductor chip. The adhesion pad formed at the surface of the bond pad includes a barrier layer, preferably a titanium/tungsten alloy, and a bonding layer, such as a sputtered gold layer. A gold ball bump is then formed on the adhesion pad. The patent also discloses methods for forming this improved structure.
Career Highlights
Marlita is currently employed at VLSI Technology, Inc., where she continues to advance her research and development efforts in semiconductor technology. Her work has been instrumental in enhancing the reliability and performance of semiconductor devices.
Collaborations
Marlita has collaborated with esteemed colleagues, including Tsing-Chow Wang and Serena M. Luo. These partnerships have fostered innovation and contributed to the success of their projects.
Conclusion
Marlita F. Macaraeg's contributions to semiconductor technology exemplify her dedication to innovation. Her patent and work at VLSI Technology, Inc. highlight her role as a leading inventor in her field.