Provo, UT, United States of America

Mark W Dewey


Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2012

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2 patents (USPTO):Explore Patents

Title: Mark W Dewey: Innovator in Finite Element Mesh Coarsening

Introduction

Mark W Dewey is a notable inventor based in Provo, UT (US). He has made significant contributions to the field of finite element analysis through his innovative techniques in mesh coarsening. With a total of 2 patents, Dewey's work has advanced the efficiency and adaptability of finite element meshes.

Latest Patents

Dewey's latest patents include "Quadrilateral Finite Element Mesh Coarsening" and "Quadrilateral/Hexahedral Finite Element Mesh Coarsening." The first patent describes techniques for coarsening a quadrilateral mesh by identifying a coarsening region and removing quadrilateral elements along a path through that region. Node pairs along opposite sides of the path are merged to collapse it effectively. The second patent outlines a method for coarsening a finite element mesh by identifying perimeter chords along the boundaries of a coarsening region. These chords are redirected to create an adaptive chord that separates the coarsening region from the remainder of the mesh, enhancing the overall mesh structure.

Career Highlights

Throughout his career, Dewey has worked with prominent organizations such as Sandia Corporation and Sandin Corporation. His experience in these companies has allowed him to refine his skills and contribute to significant advancements in finite element analysis.

Collaborations

Dewey has collaborated with notable colleagues, including Matthew L Staten and Steven E Benzley. Their combined expertise has fostered innovation in their respective fields.

Conclusion

Mark W Dewey's contributions to finite element mesh coarsening demonstrate his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of complex mesh structures and their applications.

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