Mark T McGraw

Title: Mark T McGraw - Innovator in Integrated Circuit Packaging

Introduction

Mark T McGraw is a notable inventor based in Saratoga, California. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of advanced technologies that enhance the performance and efficiency of electronic devices.

Latest Patents

Mark T McGraw holds a patent for a "Packaging and interconnect system for integrated circuits." This invention features a thin MCM packaging structure and technique that utilizes a thin film decal interconnect circuit fabricated on a thin aluminum wafer. The design employs Au metallurgy for bonding and includes a bond pad/ground plane layer, topside pads, and multiple routing layers. The unique structure allows for efficient bonding and encapsulation of integrated circuit dies, improving the overall functionality of electronic systems.

Career Highlights

Throughout his career, Mark has been associated with Micromodule Systems, Inc., where he has played a pivotal role in advancing packaging technologies. His work has been instrumental in developing solutions that meet the growing demands of the electronics industry.

Collaborations

Mark has collaborated with talented individuals such as Bradley L Griswold and Chung W Ho. These partnerships have fostered innovation and contributed to the success of their projects.

Conclusion

Mark T McGraw is a distinguished inventor whose work in integrated circuit packaging has made a lasting impact on the electronics industry. His innovative solutions continue to shape the future of technology.