Company Filing History:
Years Active: 2014-2024
Title: The Innovative Contributions of Mark T. Dimke
Introduction
Mark T. Dimke is a prominent inventor based in Cedar Rapids, Iowa, known for his significant contributions to the field of electronics and integrated circuit packaging. With a total of three patents to his name, Dimke has made a notable impact in the industry, particularly through his work with Rockwell Collins, Inc.
Latest Patents
His most recent patents include advancements in integrated circuit (IC) packaging. One such innovation is an IC package featuring a cantilever multi-chip module (MCM) heat spreader. This design incorporates a substrate with an outer portion and an inner portion that houses a semiconducting die. The package is strategically designed to maximize heat dissipation, utilizing a thermally conductive heat spreader that connects efficiently with the die to ensure optimal performance.
Another noteworthy patent addresses the method for shielding electrical circuits. This invention outlines a process for applying a potting material to an electrical circuit and creating a ground path. Furthermore, it includes the deposition of an electrically conductive coating over both the circuit and the potting material, ensuring reliable grounding and protection of electronic components.
Career Highlights
Dimke has established a successful career at Rockwell Collins, Inc., where he has been able to apply his innovative ideas to practical applications within the aerospace and defense technology sectors. His work has not only enhanced product performance but has also ensured increased reliability and efficiency for electrical systems in various aircraft.
Collaborations
Throughout his career, Mark T. Dimke has collaborated with notable colleagues, such as Brandon C. Hamilton and Luke W. Horak. Their combined efforts have contributed to advancements in various technology fields, fostering a culture of innovation and excellence within their organization.
Conclusion
Mark T. Dimke stands out as a committed inventor whose work in integrated circuit packaging and circuit shielding continues to influence the electronics industry. His innovative patents reflect a deep understanding of thermal dynamics and electrical engineering, underpinning his role as a key contributor to the advancements made by Rockwell Collins, Inc.