Mark Reed

Title: Mark Reed - Innovator in Reconfigurable Magnetic Conductors

Introduction

Mark Reed is a notable inventor based in Laurel, MD (US). He has made significant contributions to the field of electronic engineering, particularly in the development of reconfigurable artificial magnetic conductors. His innovative work has implications for various applications in telecommunications and signal processing.

Latest Patents

Mark Reed holds a patent for a Reconfigurable Artificial Magnetic Conductor (RAMC). This invention features an electronically reconfigurable design that includes a frequency selective surface (FSS) with variable effective sheet capacitance. This variability allows for the control of the resonant frequency of the RAMC. The design also incorporates a conductive backplane structure and a spacer layer that separates the backplane from the FSS. The spacer layer is equipped with conductive vias that connect the backplane and the FSS, along with voltage variable capacitive circuit elements that respond to bias voltages applied through bias signal lines.

Career Highlights

Mark Reed is currently employed at Titan Aerospace Electronic Division, where he continues to push the boundaries of innovation in electronic materials and devices. His work is characterized by a commitment to advancing technology in ways that enhance performance and functionality.

Collaborations

Mark has collaborated with several talented individuals in his field, including William E. McKinzie III and Victor C. Sanchez. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Mark Reed's contributions to the field of electronic engineering, particularly through his patent for a reconfigurable artificial magnetic conductor, highlight his innovative spirit and dedication to advancing technology. His work at Titan Aerospace Electronic Division and collaborations with fellow inventors further underscore his impact on the industry.