Omaha, NE, United States of America

Mark Lee Dierking




Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 34(Granted Patents)


Location History:

  • Topeka, KS (US) (2002 - 2012)
  • Omaha, NE (US) (2012 - 2014)

Company Filing History:


Years Active: 2002-2014

Loading Chart...
Loading Chart...
Loading Chart...
6 patents (USPTO):Explore Patents

Title: Mark Lee Dierking: Innovator in Food Composition and Processing

Introduction

Mark Lee Dierking is a notable inventor based in Omaha, NE (US), recognized for his contributions to food technology. He holds a total of 6 patents, showcasing his innovative approach to food composition and processing methods.

Latest Patents

Dierking's latest patents include a process for preparing a food composition that allows for easy removal from containers. This process involves contacting one or more hydrocolloids with water to create a colloidal solution, which is then mixed with food ingredients to form a solid mass with a gelatinous texture. Another significant patent focuses on methods for producing partially hydrated and cooked bean products. This method includes using an extruder to process uncooked whole or split beans, adding steam and water, and producing a bean paste with a water content of at least 45% by weight. This paste can be further processed into products like refried beans.

Career Highlights

Throughout his career, Dierking has worked with prominent companies such as Hill's Pet Nutrition, Inc. and Conagra Foods Rdm, Inc. His experience in these organizations has contributed to his expertise in food technology and innovation.

Collaborations

Dierking has collaborated with notable coworkers, including Wai Lun Cheuk and Dennis Edward Jewell, who have contributed to his projects and innovations in the field.

Conclusion

Mark Lee Dierking's innovative work in food composition and processing has made a significant impact in the industry. His patents reflect a commitment to improving food technology and enhancing the quality of food products.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…