Mark Forsnes

Title: Mark Forsnes: Innovator in Electronic Package Cooling Solutions

Introduction

Mark Forsnes is a notable inventor based in Folsom, California. He has made significant contributions to the field of electronic packaging, particularly in cooling technologies. With a total of two patents to his name, Forsnes continues to push the boundaries of innovation in his industry.

Latest Patents

Forsnes' latest patent focuses on "Choked Flow Cooling." This invention includes electronic packages designed with choked flow cooling mechanisms. In one embodiment, the electronic package comprises a package substrate, a die that is electrically and mechanically coupled to the substrate, and a lid positioned over the die. The lid features a first opening and a second opening that is opposite the first. Additionally, the electronic package may include a coolant plate that covers the first opening. The coolant plate has a first surface facing away from the die and a second surface facing the die, with a plurality of vents connecting the two surfaces. Notably, the first openings of these vents have a larger dimension compared to the second openings, which are smaller.

Career Highlights

Mark Forsnes is currently employed at SK Hynix NAND Product Solutions Corporation, where he applies his expertise in electronic packaging. His work focuses on developing innovative cooling solutions that enhance the performance and reliability of electronic devices.

Collaborations

Forsnes has collaborated with several talented individuals in his field, including Yuhong Cai and Florence R. Pon. These collaborations have contributed to the advancement of technology in electronic packaging.

Conclusion

Mark Forsnes is a dedicated inventor whose work in choked flow cooling has the potential to revolutionize electronic packaging. His contributions at SK Hynix NAND Product Solutions Corporation highlight his commitment to innovation and excellence in the field.