Mark Davies

Title: The Innovative Contributions of Mark Davies

Introduction

Mark Davies is a notable inventor based in Swindon, GB. He has made significant contributions to the field of packaging technology, particularly in the design of blister packs. His innovative approach has led to the development of a unique patent that enhances the functionality of blister packaging.

Latest Patents

Mark Davies holds a patent for the "Formation of indicia in the base of a blister pack for transference to a body cast therein." This invention involves a laminated film where a metal foil is sandwiched between two polymeric films. The process includes cold forming to create one or more blisters, with the base of the blister stamped with indicia in two discrete stages. The first stage involves forming the blister using a standard technique, while the second stage stamps the indicia into the base of the blister. This innovative method allows for the indicia to project either inwardly or outwardly from the blister base, depending on the design requirements.

Career Highlights

Mark Davies is currently employed at R.P. Scherer Technologies, Inc., where he continues to develop innovative packaging solutions. His work has been instrumental in advancing the technology used in blister packaging, making it more efficient and user-friendly.

Collaborations

Mark collaborates with his coworker, Patrick Kearney, to further enhance their projects and drive innovation within their company.

Conclusion

Mark Davies is a pioneering inventor whose work in blister packaging technology has made a significant impact in the industry. His patent showcases his innovative thinking and dedication to improving product design.