Company Filing History:
Years Active: 2005
Title: Mark A Irwin: Innovator in Wafer-Level Chip Scale Packaging
Introduction
Mark A Irwin is a notable inventor based in Tucson, AZ (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer-level chip scale packaging (WCSP). His innovative approach has led to advancements that enhance the performance and reliability of electronic devices.
Latest Patents
Mark A Irwin holds 1 patent for his invention titled "Barrier region and method for wafer scale package (WCSP) devices." This patent describes a barrier region provided in the active surface of a WCSP device or chip. The invention aims to substantially reduce the amount of photon-generated substrate current that reaches active circuitry within the active area of the chip, thereby improving its functionality.
Career Highlights
Mark A Irwin is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work at Texas Instruments has allowed him to collaborate with other talented professionals and contribute to cutting-edge technology in electronic components.
Collaborations
One of his notable coworkers is Rodney T Burt, with whom he has likely shared insights and expertise in their field. Their collaboration may have further advanced the innovations at Texas Instruments.
Conclusion
Mark A Irwin's contributions to wafer-level chip scale packaging demonstrate his commitment to innovation in the semiconductor industry. His patent reflects a significant advancement that enhances the performance of electronic devices.