This inventor holds 7 USPTO granted patents and 3 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2023-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023-2025
Title: Manho Lee: Innovator in Semiconductor Packaging
Introduction
Manho Lee is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.
Latest Patents
Among his latest innovations, Manho Lee has developed a semiconductor package that includes a first semiconductor chip with a logic structure and a second semiconductor chip bonded to it. This design features signal lines on the first surface of the first semiconductor substrate, a power delivery network on the opposite surface, and penetration vias that connect these components. Additionally, he has created another semiconductor package that incorporates multiple semiconductor chips stacked together, featuring through electrodes and bonding wires that enhance connectivity and performance.
Career Highlights
Manho Lee is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the capabilities of modern electronic devices.
Collaborations
He collaborates with talented coworkers, including Eunseok Song and Kyungsuk Oh, who contribute to the innovative projects at Samsung Electronics.
Conclusion
Manho Lee's contributions to semiconductor packaging exemplify the spirit of innovation in technology. His patents reflect a commitment to improving electronic device performance and efficiency.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile