Company Filing History:
Years Active: 2024
Title: Mamoru Sunada: Innovator in Hollow Package Technology
Introduction
Mamoru Sunada is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of packaging technology, particularly with his innovative designs and methods.
Latest Patents
Sunada holds a patent for a hollow package and the method for manufacturing it. This hollow package includes a substrate, an element, a partition wall, and a top plate. It features one or more closed hollow parts that are covered by the substrate, partition wall, and top plate. The components are sealed with a cured product of a sealing resin composition. The top plate and partition wall are made from an organic material, with specific thicknesses and widths that fall within predetermined ranges. The sealing resin composition consists of an epoxy resin and an inorganic filler, showcasing Sunada's expertise in material science.
Career Highlights
Sunada is associated with Nippon Kayaku Kabushiki Kaisha, where he has been able to apply his innovative ideas in a practical setting. His work has contributed to advancements in packaging solutions that are both efficient and effective.
Collaborations
Sunada has collaborated with notable colleagues such as Tadashi Naito and Nao Honda. Their combined efforts have fostered a creative environment that encourages innovation and development in their respective fields.
Conclusion
Mamoru Sunada's contributions to packaging technology through his patent for a hollow package demonstrate his innovative spirit and commitment to advancing the industry. His work continues to influence the field and inspire future innovations.