Location History:
- Hamura, JP (2011)
- Tokyo, JP (2023 - 2024)
Company Filing History:
Years Active: 2011-2024
Title: Mami Kushima: Innovator in Wire Bonding Technology
Introduction
Mami Kushima is a prominent inventor based in Hamura, Japan. She has made significant contributions to the field of wire bonding technology, holding three patents that showcase her innovative approach to connecting wires in electronic applications. Her work is instrumental in enhancing the efficiency and reliability of electronic connections.
Latest Patents
Kushima's latest patents include a wire bonding method and apparatus designed for connecting a wire to two different surfaces with a single bonding step. This method involves bonding one end of a wire to a first bonding surface, followed by precise movements of the capillary in multiple directions to ensure accurate placement. Additionally, her method for bonding insulated coating wire allows for stable connections between electrodes using a metal wire coated with an organic substance. This innovative approach includes steps for exposing the metal wire and forming a bump to establish electrical connections.
Career Highlights
Mami Kushima is currently employed at Kaijo Corporation, where she continues to develop cutting-edge technologies in wire bonding. Her expertise and dedication to her work have positioned her as a key figure in her field.
Collaborations
Kushima collaborates with talented coworkers, including Riki Jindo and Hideki Yoshino, who contribute to her innovative projects and research efforts.
Conclusion
Mami Kushima's contributions to wire bonding technology reflect her commitment to innovation and excellence. Her patents not only advance the field but also demonstrate her role as a leading inventor in Japan.