Location History:
- Kanagawa, JA (1976)
- Shibukawa, JP (1994 - 2002)
Company Filing History:
4 out of 475 
1 out of 1 Years Active: 1976-2002
Title: Makoto Fukuda: Innovator in Metal-Base Multilayer Circuit Substrates
Introduction
Makoto Fukuda is a prominent inventor based in Shibukawa, Japan. He has made significant contributions to the field of circuit substrates, particularly focusing on metal-base multilayer designs. With a total of 4 patents to his name, Fukuda's work has advanced the technology used in electronic devices.
Latest Patents
Fukuda's latest patents include innovative designs for metal-base multilayer circuit substrates. One of his notable inventions is a metal-base multilayer circuit substrate with a heat conducting adhesive. This substrate features a metal plate and a circuit substrate bonded by a first insulating adhesive layer that contains metal oxides and/or metal nitrides, providing a heat resistance of at most 2.5°C/W. Another significant patent is for a metal-base multilayer circuit substrate that utilizes a heat conductive adhesive layer. This design enhances heat conductivity and allows for excellent heat dissipating properties, making it ideal for various electronic applications.
Career Highlights
Throughout his career, Fukuda has worked with notable companies such as Denki Kagaku Kogyo Kabushiki Kaisha and Nippon Kayaku K.K. His experience in these organizations has contributed to his expertise in developing advanced circuit substrate technologies.
Collaborations
Fukuda has collaborated with talented individuals in his field, including Naomi Yonemura and Toshiki Saitoh. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Makoto Fukuda's contributions to the field of metal-base multilayer circuit substrates demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and their applications in electronics.