Maggie Deng

Title: The Innovative Contributions of Maggie Deng

Introduction

Maggie Deng is a prominent inventor based in Shanghai, China. She has made significant strides in the field of semiconductor technology. Her innovative approach has led to the development of a unique method that enhances the manufacturing process of semiconductor dies.

Latest Patents

Maggie holds a patent for a method of thinning a semiconductor die. This method involves providing a semiconductor die with electrical contacts that protrude from its top surface. The electrical contacts are strategically spaced apart and encapsulated, while a semisolid filler covers a portion of the top surface. This filler fills the gaps between the electrical contacts. An adhesive layer is then applied to the top surface of the semisolid filler, followed by a backgrinding process on the bottom surface of the semiconductor die. This innovative method allows for the production of thinner semiconductor dies while minimizing the risk of defects associated with backgrinding. She has 1 patent to her name.

Career Highlights

Maggie Deng is currently employed at Western Digital Technologies, Inc., where she continues to push the boundaries of semiconductor technology. Her work has been instrumental in improving manufacturing processes and enhancing product quality.

Collaborations

Maggie collaborates with talented coworkers, including Meiqin Hao and Izzie Zhang. Their combined expertise fosters a creative environment that drives innovation within their projects.

Conclusion

Maggie Deng's contributions to semiconductor technology exemplify the impact of innovative thinking in the industry. Her patented method for thinning semiconductor dies showcases her commitment to advancing technology while ensuring quality and efficiency.