Manchester, MA, United States of America

M Arif Zeeshan

USPTO Granted Patents = 6 

Average Co-Inventor Count = 3.8

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Manchester-by-the-sea, MA (US) (2022)
  • Manchester, MA (US) (2023 - 2024)

Company Filing History:


Years Active: 2022-2025

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6 patents (USPTO):

Title: Innovations by M Arif Zeeshan

Introduction

M Arif Zeeshan is a prominent inventor based in Manchester, MA (US). He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His work focuses on advanced techniques for material deposition, which are crucial for the development of various electronic devices.

Latest Patents

One of his latest patents is titled "Techniques and device structures based upon directional dielectric deposition and bottom-up fill." This invention includes methods for achieving void-free material depositions on substrates, particularly in void-free trench-filled components. The process involves providing a plurality of device structures and forming a dielectric layer using angled deposition techniques. Another notable patent is "Techniques for void-free material depositions," which utilizes directional etching to remove specific portions of a seed layer. This method allows for the patterning of fill materials in tight spaces without any voids or seams, making it applicable in various semiconductor devices such as transistors and memory components.

Career Highlights

M Arif Zeeshan is currently employed at Applied Materials, Inc., a leading company in the semiconductor industry. His innovative approaches have positioned him as a key figure in advancing semiconductor manufacturing processes.

Collaborations

He has collaborated with notable coworkers, including Kelvin Chan and Shantanu Kallakuri, contributing to the development of cutting-edge technologies in their field.

Conclusion

M Arif Zeeshan's work exemplifies the importance of innovation in semiconductor technology. His patents reflect a commitment to enhancing the efficiency and effectiveness of material deposition techniques, which are vital for the future of electronic devices.

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