Company Filing History:
1 out of 832,843 Years Active: 2003
Title: The Innovative Breakthroughs of Long Chen Lai in Mold Flash Removal
Introduction: Long Chen Lai, an inventive mind hailing from Singapore, has made significant contributions to the field of integrated circuit (IC) device manufacturing. With a keen focus on enhancing production techniques, he has been recognized for his pioneering patent addressing the challenges posed by mold flash.
Latest Patents: Long Chen Lai holds a notable patent titled "Method and apparatus for removal of mold flash." This invention presents a novel non-thermal laser ablation method for effectively removing mold flash from IC devices. The approach entails converting the mold flash into plasma using brief laser pulses, which minimizes thermal processes and protects the underlying heat sink from damage. Key features of this innovation include a protective mask designed to shield the molded packaging from the laser, ensuring that the laser beam passes only through holes corresponding to the heat sink. Additionally, the use of a large beam diameter enhances the efficiency of the deflashing process.
Career Highlights: Although specific details about Long Chen Lai's career trajectory are not extensively documented, his patent signifies a remarkable milestone in his professional journey. His expertise aligns with advancements in manufacturing technologies where precision and safety are paramount.
Collaborations: Throughout his career, Long Chen Lai has collaborated with talented colleagues, including Yong Feng Lu and Yak Hui Sim. Their teamwork showcases the synergy that often drives innovation in technical fields, fostering an environment where groundbreaking ideas can flourish.
Conclusion: Long Chen Lai exemplifies the spirit of innovation within the realm of integrated circuit technology. His patent for mold flash removal underscores the vital role of inventors in advancing manufacturing processes. As the industry continues to evolve, contributions like those from Long Chen Lai serve as a testament to the power of creativity and collaboration in overcoming technical challenges.