Liyan Siow

Title: Liyan Siow: Innovator in Acoustic Device Packaging

Introduction

Liyan Siow is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor technology. He has developed innovative solutions that enhance the performance of acoustic devices. His work is characterized by a focus on improving the efficiency and effectiveness of sound transmission through advanced packaging structures.

Latest Patents

Liyan Siow holds a patent for a "Packaging structure and method of acoustic device." This invention involves a substrate and a piezoelectric stack structure, which are essential components in the design of acoustic devices. The patent describes a unique configuration of organic material layers that facilitate the reflection of acoustic waves, thereby reducing loss and enhancing device performance. The first organic material layer includes supporting parts that create acoustic reflection structures, ensuring that sound waves are effectively managed within the device.

Career Highlights

Liyan Siow is currently employed at Wuhan Memsonics Technologies Co., Ltd., where he continues to innovate in the field of acoustic technology. His work has significantly contributed to advancements in semiconductor applications, particularly in the design and functionality of acoustic devices. With a focus on practical solutions, Siow's inventions aim to address real-world challenges in sound technology.

Collaborations

Liyan Siow collaborates with talented professionals in his field, including Zhipeng Ding and Qin Ren. These partnerships enhance the creative process and lead to the development of cutting-edge technologies in acoustic devices.

Conclusion

Liyan Siow's innovative work in the packaging of acoustic devices showcases his expertise and commitment to advancing semiconductor technology. His patent reflects a significant step forward in improving acoustic performance, making him a valuable contributor to the field.