Company Filing History:
Years Active: 2004
Title: Innovator Spotlight: Liusheng Wang and His Microwave Assisted Bonding Method
Introduction: Liusheng Wang, an accomplished inventor based in Irvine, CA, has made significant strides in the field of materials science and engineering. With his innovative approach to bonding components, Wang has pioneered a method that showcases the potential for advancements in manufacturing and product design.
Latest Patents: Wang holds a patent for his groundbreaking work titled "Microwave Assisted Bonding Method and Joint." This patent details a unique technique for bonding two components together using a film coating of electrically conductive material. The process involves applying a thin film with a thickness of less than 200 nanometers at the interface between the two components. By positioning them correctly and applying microwave energy, thermal energy is generated, allowing for a strong bond to form between the surfaces.
Career Highlights: Currently, Liusheng Wang is associated with Corning Incorporated, a leading company in material science and innovative glass technology. His work contributes to Corning's commitment to advancing technology across various industries, emphasizing the importance of innovative solutions in modern manufacturing processes.
Collaborations: Throughout his career, Wang has collaborated with esteemed colleagues, including Scott M. Hellman and Paul A. Townley-Smith. These partnerships exemplify the collaborative spirit prevalent in research and development, driving progress and innovation.
Conclusion: Liusheng Wang's contributions to the field of bonding methods are a testament to the importance of innovation in technology and engineering. His patent not only reflects his expertise and creativity but also paves the way for future advancements in manufacturing processes. As industry demands grow for more efficient and effective bonding techniques, inventors like Wang will play a crucial role in shaping the future of technology.