ZhaBei Dist., China

Liu C Lei



Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Innovations by Liu C Lei in Electronic Component Assembly

Introduction

Liu C Lei, an accomplished inventor based in ZhaBei District, China, has made significant contributions to the field of electronic component assembly. With one patented invention to her name, she focuses on enhancing the efficiency and effectiveness of electronic device manufacturing.

Latest Patents

Liu C Lei holds a patent titled "Assembly for Mounting Electronic Components, Methods of Use and Manufacture Thereof." This innovative assembly includes a face plate made of thermoplastic material, which features a retaining element designed to secure a captive screw and spring assembly for mounting electronic printed circuit boards. The retaining element is equipped with slots that allow for expansion, facilitating the insertion of the screw while preventing it from loosening. This design effectively eliminates the need for traditional metal standoffs typically used in similar devices. The patent also covers methods for the preparation and mounting of printed circuit boards.

Career Highlights

Currently employed at Parker-Hannifin Corporation, Liu has leveraged her expertise in electronic assembly design to develop solutions that improve manufacturing processes and product reliability. Her work reflects a commitment to innovation in the electronics sector, demonstrating her ability to merge technical knowledge with practical application.

Collaborations

Liu C Lei works alongside notable colleagues such as Chi Hang Wu and Thomas J Socci, who are integral to her projects at Parker-Hannifin Corporation. This collaborative environment fosters creativity and drives the development of groundbreaking technologies in the industry.

Conclusion

Through her inventive spirit and technical proficiency, Liu C Lei has established herself as a key player in the field of electronic component assembly. Her patented invention not only showcases her innovative approach but also highlights the strides being made in electronics manufacturing, setting a standard for future developments in this vital sector.

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