Linsheng Wu

Title: Linsheng Wu: Innovator in Heat Dissipation Technology

Introduction

Linsheng Wu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of heat dissipation technology, particularly in the optimization of silicon-based packaging methods. His innovative approach has implications for the miniaturization and integration of electronic components.

Latest Patents

Linsheng Wu holds a patent for a "Heat dissipation optimization method of silicon-based SU-8 thin film package." This method involves the arrangement of a molybdenum copper sheet on the back of an embedded chip. The chip wiring and interconnection are realized on the front side of the silicon substrate through a metal pattern on the SU-8 photoresist. The silicon wafer thinning process exposes the molybdenum copper sheet, allowing direct contact with the heat sink to optimize heat dissipation. The use of SU-8 photoresist as the packaging medium enables the realization of complex three-dimensional structures, fulfilling the requirements for high integration and miniaturization in packaging.

Career Highlights

Linsheng Wu is affiliated with Shanghai Jiao Tong University, where he continues to advance research in his field. His work has garnered attention for its innovative solutions to common challenges in electronic packaging.

Collaborations

He has collaborated with notable colleagues, including Xianglin Zhong and Zhonglin Xu, contributing to various research projects and advancements in technology.

Conclusion

Linsheng Wu's contributions to heat dissipation technology exemplify the innovative spirit of modern inventors. His work not only enhances the performance of electronic devices but also paves the way for future advancements in the field.