Linlang Wu

Title: Innovations by Linlang Wu in High-Speed Polishing Technology

Introduction

Linlang Wu is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of polishing technology, particularly for miniature components. With a total of 2 patents, his work focuses on enhancing the efficiency and effectiveness of polishing processes.

Latest Patents

Linlang Wu's latest patents include a high-speed barrel polishing device. This innovative device is designed for polishing a large number of miniature components, such as multi-layer electronic components. The invention modifies a vertical planetary ball mill or other barrel polishing devices to rotate polishing containers with a specially designed interior cavity structure. This structure features a smooth, gradually curved interior sidewall that improves circulation within the container during high-speed vertical polishing rotation. The enhanced circulation allows for polishing a larger number of components in less time compared to existing polishing container structures. Additionally, the containers can be rotated around a tilted axis, which reduces collisions and increases relative polishing movement within the container.

Career Highlights

Linlang Wu is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to further develop his innovative ideas and contribute to advancements in polishing technology.

Collaborations

Some of Linlang Wu's coworkers include Yuanfeng Ma and Sheng Zhang. Their collaboration has likely played a role in the development of his innovative patents.

Conclusion

Linlang Wu's contributions to high-speed polishing technology demonstrate his commitment to innovation and efficiency in the field. His patents reflect a deep understanding of the challenges in polishing miniature components and offer practical solutions to enhance the process.