Company Filing History:
1 out of 5 
1 out of 1 
1 out of 2 Years Active: 2000-2004
Title: Innovations by Ligui Zhou
Introduction
Ligui Zhou is an accomplished inventor based in Pleasanton, CA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving the efficiency and reliability of semiconductor packaging processes.
Latest Patents
One of Ligui Zhou's latest patents is titled "Semiconductor flip-chip package and method for the fabrication thereof." This patent describes a simplified process for flip-chip attachment of a chip to a substrate. The innovation involves precoating the chip with an encapsulant underfill material that contains separate discrete solder columns. This method eliminates the conventional capillary flow underfill process, allowing for the incorporation of remeltable layers for rework, testing, or repair. Additionally, it enables the integration of electrical redistribution layers. The process involves placing the chip and pre-coated encapsulant at an angle to the substrate, pivoting them to expel gas until the solder bumps are fully in contact with the substrate. The design also features a compliant solder/flexible encapsulant understructure that accommodates thermal expansion differences between the chip and substrate without causing bending.
Career Highlights
Throughout his career, Ligui Zhou has worked with various companies, including Miguel Albert Capote. His expertise in semiconductor technology has positioned him as a key player in the industry, contributing to advancements that enhance the performance and durability of electronic devices.
Collaborations
Some of his notable coworkers include Miguel Albert Capote and Zhiming Zhou. Their collaborative efforts have furthered the development of innovative solutions in semiconductor packaging.
Conclusion
Ligui Zhou's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His innovative approaches continue to shape the future of electronic device manufacturing.