Singapore, Singapore

Liem T Pao

This inventor holds 2 USPTO granted patents. Top assignees: P.t.h.m. Sampoerna, Other. Active years: 1989-1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Liem T Pao. Retrieved from https://idiyas.com/inventor/liem-t-pao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 26(Granted Patents)


Company Filing History:


Years Active: 1989-1994

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2 patents (USPTO):Explore Patents

Title: Liem T Pao: Innovator in Cutting and Packaging Technologies

Introduction

Liem T Pao is a notable inventor based in Singapore, recognized for his contributions to packaging and cutting technologies. With a total of 2 patents, he has developed innovative solutions that enhance the efficiency and functionality of various processes.

Latest Patents

Liem's latest patents include an "Innerframe and apparatus for producing an improved innerframe" and a "Cutting apparatus for living plant materials." The innerframe patent describes a frame designed to securely retain a bundle of elongated members, such as cigarettes, within a container. This container features a bottom box panel, a top lid box panel, opposing side panels, and a front and back box panel. The frame is structured to fit snugly within the container, ensuring the contents are held securely. The cutting apparatus patent outlines a reciprocating cutting device specifically for living plant materials. This apparatus includes a frame with a cutting assembly that synchronizes the feeding of materials, allowing for precise cutting while maintaining the integrity of the living plant material.

Career Highlights

Throughout his career, Liem T Pao has worked with various companies, including P.T.H.M. Sampoerna. His experience in these organizations has contributed to his expertise in developing innovative technologies that address industry needs.

Collaborations

Liem has collaborated with notable individuals in his field, including Tsun-Chuan Wu and Foo-Kong Wong. These partnerships have likely fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Liem T Pao's work exemplifies the spirit of innovation in the fields of packaging and cutting technologies. His patents reflect a commitment to improving processes and enhancing product integrity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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