Dallas, TX, United States of America

Liem H Higa

This inventor holds 3 USPTO granted patents. Top assignee: Corning Cable Systems. Active years: 2001-2008.


% Patents Active = 100.0

Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 233(Granted Patents)


Company Filing History:


Years Active: 2001-2008

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3 patents (USPTO):Explore Patents

Title: Liem H Higa: Innovator in Network Interface Technology

Introduction

Liem H Higa is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of communications equipment, holding a total of 3 patents. His innovative designs focus on enhancing the functionality and reliability of network interface devices.

Latest Patents

One of Liem H Higa's latest patents is an enclosure for housing communications equipment. This invention features a watertight seal for a network interface device. The design includes a base and a protective outer cover that can move between an opened and closed position. The base has a channel, while the outer cover has a corresponding lip that fits into the channel, creating a watertight seal when closed. This innovative design allows moisture to drain away, protecting the internal equipment and wiring without the need for elastic seals or gaskets.

Career Highlights

Liem H Higa is currently employed at Corning Cable Systems, where he continues to develop cutting-edge technologies in the communications sector. His work has been instrumental in advancing the reliability and efficiency of network interface devices.

Collaborations

Liem has collaborated with notable colleagues such as Stephen Guy Bloodworth and William C K Wang. Their combined expertise has contributed to the successful development of innovative solutions in the field.

Conclusion

Liem H Higa's contributions to network interface technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in communications equipment, paving the way for future advancements in the industry.

Profile summary based on public USPTO records.
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