Liangfeng Qiu

Title: Innovations of Liangfeng Qiu in Heat Dissipation Technology

Introduction

Liangfeng Qiu is a notable inventor based in Shanghai, China. He has made significant contributions to the field of heat dissipation technology, particularly in the optimization of silicon-based packaging methods. His innovative approach addresses critical challenges in the integration and miniaturization of electronic components.

Latest Patents

Liangfeng Qiu holds a patent for a "Heat dissipation optimization method of silicon-based SU-8 thin film package." This method involves the arrangement of a molybdenum copper sheet on the back of an embedded chip. The chip wiring and interconnection are realized on the front side of the silicon substrate through a metal pattern on the SU-8 photoresist. The silicon wafer thinning process exposes the molybdenum copper sheet, allowing direct contact with the heat sink to optimize heat dissipation. The use of SU-8 photoresist as the packaging medium enables the realization of complex three-dimensional structures, fulfilling the requirements for high integration and miniaturization.

Career Highlights

Liangfeng Qiu is affiliated with Shanghai Jiao Tong University, where he continues to advance research in microelectromechanical systems (MEMS) and related fields. His work has garnered attention for its practical applications in modern electronics.

Collaborations

Liangfeng has collaborated with esteemed colleagues, including Linsheng Wu and Xianglin Zhong, to further enhance the impact of their research in the field of heat dissipation and packaging technologies.

Conclusion

Liangfeng Qiu's innovative contributions to heat dissipation optimization reflect his commitment to advancing technology in the electronics sector. His work not only addresses current challenges but also paves the way for future developments in high-performance packaging solutions.