Company Filing History:
Years Active: 2018
Title: The Innovative Contributions of Li Yan Siow
Introduction
Li Yan Siow is a prominent inventor based in Singapore, known for her significant contributions to the field of wafer bonding technology. With a focus on developing methods that enhance the efficiency and effectiveness of semiconductor manufacturing, she has made strides in innovation that benefit the industry.
Latest Patents
Li Yan Siow holds a patent for a groundbreaking method titled "Method for Low Temperature Bonding of Wafers." This innovative technique involves bonding wafers by utilizing a first wafer with an exposed first layer made of a first metal and a second wafer with an exposed second layer made of a second metal. The first and second metals are capable of forming a eutectic mixture with a eutectic melting temperature. The method includes contacting the first layer with the second layer and applying a predetermined pressure at a temperature below the eutectic melting temperature to create a solid-state diffusion bond.
Career Highlights
Li Yan Siow is affiliated with the Agency for Science, Technology and Research, where she continues to push the boundaries of research and development in her field. Her work has not only contributed to her personal achievements but has also advanced the capabilities of her organization in semiconductor technology.
Collaborations
Throughout her career, Li has collaborated with notable colleagues such as Vivek Chidambaram and Sunil Wickramanayaka. These partnerships have fostered an environment of innovation and have led to the successful development of new technologies.
Conclusion
Li Yan Siow's contributions to wafer bonding technology exemplify her dedication to innovation in the semiconductor industry. Her patent and collaborative efforts highlight her role as a leading inventor in Singapore.